A54SX32A-FG256M

• Manufacturer Part Number:

  A54SX32AFG256M

  
  

• Rohs Code:

  No

  
  

• Part Life Cycle Code:

  Active

  
  

• Ihs Manufacturer:

  MICROSEMI CORP

  
  

• Package Description:

  BGA, BGA256,16X16,40

  
  

• ECCN Code:

  3A001.A.2.C

  
  

• HTS Code:

  8542.39.00.01

  
  

• Manufacturer:

  Microsemi Corporation

  
  

• Risk Rank:

  5.23

  
  

• Additional Feature:

  32000 TYPICAL GATES AVAILABLE

  
  

• Clock Frequency-Max:

  238 MHz

  
  

• Combinatorial Delay of a CLB-Max:

  1.2 ns

  
  

• JESD-30 Code:

  S-PBGA-B256

  
  

• JESD-609 Code:

  e0

  
  

• Length:

  17 mm

  
  

• Moisture Sensitivity Level:

  3

  
  

• Number of CLBs:

  2880

  
  

• Number of Equivalent Gates:

  48000

  
  

• Number of Inputs:

  203

  
  

• Number of Logic Cells:

  2880

  
  

• Number of Outputs:

  203

  
  

• Number of Terminals:

  256

  
  

• Operating Temperature-Max:

  125 °C

  
  

• Operating Temperature-Min:

  -55 °C

  
  

• Organization:

  2880 CLBS, 48000 GATES

  
  

• Package Body Material:

  PLASTIC/EPOXY

  
  

• Package Code:

  BGA

  
  

• Package Equivalence Code:

  BGA256,16X16,40

  
  

• Package Shape:

  SQUARE

  
  

• Package Style:

  GRID ARRAY

  
  

• Peak Reflow Temperature (Cel):

  225

  
  

• Power Supplies:

  2.5,3.3/5 V

  
  

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