XC7K325T-2FFG900I

供应商 XC7K325T-2FFG900I货期 XC7K325T-2FFG900I价格 XC7K325T-2FFG900I订货微信13632767652

• Manufacturer Part Number:

  XC7K325T-2FFG900I

  
  

• Pbfree Code:

  Yes

  
  

• Rohs Code:

  Yes

  
  

• Part Life Cycle Code:

  Active

  
  

• Ihs Manufacturer:

  XILINX INC

  
  

• Part Package Code:

  BGA

  
  

• Package Description:

  BGA, BGA900,30X30,40

  
  

• Pin Count:

  900

  
  

• ECCN Code:

  3A991.D

  
  

• HTS Code:

  8542.39.00.01

  
  

• Manufacturer:

  Xilinx

  
  

• Risk Rank:

  2.17

  
  

• Clock Frequency-Max:

  1818 MHz

  
  

• Combinatorial Delay of a CLB-Max:

  0.61 ns

  
  

• JESD-30 Code:

  S-PBGA-B900

  
  

• JESD-609 Code:

  e1

  
  

• Length:

  31 mm

  
  

• Moisture Sensitivity Level:

  4

  
  

• Number of CLBs:

  25475

  
  

• Number of Inputs:

  500

  
  

• Number of Logic Cells:

  326080

  
  

• Number of Outputs:

  500

  
  

• Number of Terminals:

  900

  
  

• Operating Temperature-Max:

  100 °C

  
  

• Operating Temperature-Min:

  -40 °C

  
  

• Organization:

  25475 CLBS

  
  

• Package Body Material:

  PLASTIC/EPOXY

  
  

• Package Code:

  BGA

  
  

• Package Equivalence Code:

  BGA900,30X30,40

  
  

• Package Shape:

  SQUARE

  
  

• Package Style:

  GRID ARRAY

  
  

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

  
  

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