XC6VLX240T-2FFG1759C现货XC6VLX240T-2FFG1759C价格XC6VLX240T-2FFG1759C 货期XC6VLX240T-2FFG1759C 订货微信13632767652

深圳市国宇航芯科技有限公司

公司主要经销：ADI TI XILINX ALTERA  IDT MSC  QORVO  CREE EUVIS等

产品功能涉及:DSP FPGA A/D转换 D/A转换 MCU DDR  MOSFET 微波射频等。

产品用途涉及：航空航天 通信 微波 雷达导弹 战舰 航海等重型设备和高端&高可靠设备。

只做原装正品！

联系人黄云艳

手机13632767652  微信同号

电话0755-84829291

QQ： 1256290132

XC6VLX240T-2FFG1759C的详细资料

• Manufacturer Part Number:

  XC6VLX240T-2FFG1759C

  
  

• Pbfree Code:

  Yes

  
  

• Rohs Code:

  Yes

  
  

• Part Life Cycle Code:

  Active

  
  

• Ihs Manufacturer:

  XILINX INC

  
  

• Part Package Code:

  BGA

  
  

• Package Description:

  BGA, BGA1759,42X42,40

  
  

• Pin Count:

  1759

  
  

• ECCN Code:

  3A001.A.7.A

  
  

• HTS Code:

  8542.39.00.01

  
  

• Manufacturer:

  Xilinx

  
  

• Risk Rank:

  5.09

  
  

• Clock Frequency-Max:

  1286 MHz

  
  

• Combinatorial Delay of a CLB-Max:

  4.29 ns

  
  

• JESD-30 Code:

  S-PBGA-B1759

  
  

• JESD-609 Code:

  e1

  
  

• Length:

  42.5 mm

  
  

• Moisture Sensitivity Level:

  4

  
  

• Number of Inputs:

  720

  
  

• Number of Logic Cells:

  241152

  
  

• Number of Outputs:

  720

  
  

• Number of Terminals:

  1759

  
  

• Operating Temperature-Max:

  85 °C

  
  

• Package Body Material:

  PLASTIC/EPOXY

  
  

• Package Code:

  BGA

  
  

• Package Equivalence Code:

  BGA1759,42X42,40

  
  

• Package Shape:

  SQUARE

  
  

• Package Style:

  GRID ARRAY

  
  

• Peak Reflow Temperature (Cel):

  245

  
  

• Power Supplies:

  1,1.2/2.5 V

  
  

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

  
  

• Qualification Status:

  Not Qualified

  
  

• Seated Height-Max:

  3.5 mm

  
  

• Subcategory:

  Field Programmable Gate Arrays

  
  

• Supply Voltage-Max:

  1.05 V

  
  

• Supply Voltage-Min:

  0.95 V

  
  

• Supply Voltage-Nom:

  1 V

  
  

• Surface Mount:

  YES

  
  

• Technology:

  CMOS

  
  

• Temperature Grade:

  OTHER

  
  

• Terminal Finish:

  Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  
  

• Terminal Form:

  BALL

  
  

• Terminal Pitch:

  1 mm

  
  

• Terminal Position:

  BOTTOM

  
  

• Time@Peak Reflow Temperature-Max (s):

  30

  
  

• Width:

  42.5 mm