LFXP10C-3FN256C国宇航芯北京军工IC订货
商品详情
LFXP10C-3FN256C
供应商
产品类别
说明
FPGA LatticeXP Family 10000 Cells 320MHz 130nm Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
产品技术规格
| 欧盟限制某些有害物质的使用 | Compliant |
| ECCN (US) | 3A001.a.7.a |
| Family Name | LatticeXP |
| User I/Os | 188 |
| Process Technology | 130nm |
| Number of I/O Banks | 8 |
| Number of Inter Dielectric Layers | 8 |
| Operating Supply Voltage (V) | 3.3|2.5|1.8 |
| Logic Elements | 10000 |
| Program Memory Type | SRAM |
| Embedded Memory (Kbit) | 216 |
| Total Number of Block RAM | 24 |
| Maximum Distributed RAM Bits | 39936 |
| Device Logic Units | 10000 |
| Number of Global Clocks | 4 |
| Device Number of DLLs/PLLs | 4 |
| Programmability | Yes |
| Reprogrammability Support | Yes |
| Copy Protection | No |
| In-System Programmability | Yes |
| Opr. Frequency (MHz) | 320 |
| Speed Grade | 3 |
| Maximum Differential I/O Pairs | 76 |
| Minimum Operating Supply Voltage (V) | 1.71 |
| Maximum Operating Supply Voltage (V) | 3.465 |
| I/O Voltage (V) | 1.2|1.5|3.3|2.5|1.8 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 85 |
| Supplier Temperature Grade | Commercial |
| Packaging | Tray |
| Tradename | LatticeXP |
| Supplier Package | FBGA |
| Standard Package Name | BGA |
| Pin Count | 256 |
| Mounting | Surface Mount |
| Package Height | 1.2 |
| Package Length | 17 |
| Package Width | 17 |
| PCB changed | 256 |
| Lead Shape | Ball |
5AGTFD3H3F35I3N Altera / Enperion
5SGXMA5K2F35C2N Altera / Enperion
EP4SE360F35I4N Altera / Enperion
5SGXMB9R2H43C2N Altera / Enperion
EP4CE40F23C6N Altera / Enperion
10AX090H2F34I2SG Altera / Enperion
EP2C8AF256I8N Altera / Enperion
EN63A0QI Altera / Enperion
EP2S180F1020C3N Altera / Enperion
5M1270ZF256I5N Altera / Enperion
EP3C25F256A7N Altera / Enperion
XCZU9EG-1FFVC900I Xilinx
XC6SLX45T-3CSG484C Xilinx
XC2C256-7TQG144C Xilinx
XC6SLX4-2CSG225I Xilinx
XC7K160T-2FFG676C Xilinx
XC3S50AN-4TQG144I Xilinx
MT40A1G16WBU-083E:B Micron
TPS4H160BQPWPRQ1 TI
